Solution case of semiconductor film bubble eliminate
Introduction to manufacturing process:
A layer of protective film is pasted on the surface of semiconductor components to protect the surface from scratch, chemical pollution and erosion, or to increase the appearance
common problem:
When the protective film is attached, if there are bubbles on the surface of the film, it will easily lead to the damage and scrap of the components or affect the quality of the later process, such as peeling off the protective film or incomplete printing content.
Test Vehicle : FO Wafer
Material: 2 in 1 LC tape w/ DC tape
Equipment: VPS Series
Failure Mode: Void between LC & DC tape
Engineering Comment:
After VPS de-voiding, no void trapped inside.
