Underfill De-void
Introduction to the process:
The chip was combined with wafer by means of cladding through bump or sole ball. Then, the gap rubber was filled with capillary phenomenon principle
FAQs:
After filling the adhesive at the bottom, bubbles often occur, which will cause the product reliability problem. The internal bubbles will lead to the bridging of subsequent processes between the solders of the welding furnace, which will lead to the failure of the function of the components
Problem solving:
After filling the bottom, vacuum and pressure are applied in the cavity and heated to bake, which can effectively achieve the effect of bubble eliminate.
